Probrano po: Friction stir welding of new electronic packaging materials SiCp/Al composite with T-joint / Zeng Gao, Jianguang Feng, Huanyu Yang, Jukka Pakkanen, Jitai Niu. CL:10001
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./public/core/img/default_03.pngEngineering review : 38,3(2018) /editor-in-chief Josip Brnić.